发明名称 MOLDING APPARATUS AND MOLDING METHOD FOR MOLDED OBJECT
摘要 PROBLEM TO BE SOLVED: To provide a molding apparatus capable of manufacturing a molded object with high accuracy.SOLUTION: A molding apparatus 1 includes: a mounting part 150 where a sheet produced by binding fibers with a thermoplastic resin is mounted; a cutting part 160 for cutting a first sheet mounted on the mounting part 150 into an effective region to constitute a molded object and an unnecessary region not to constitute the molded object; a removing part 165 for cutting and removing a part of the unnecessary region of the first sheet cut by the cutting part 160; a stacking part 140 for stacking a second sheet on the first sheet in which the unnecessary region is removed by the removing part 165; and a heating part 170 for heating the second sheet to melt at least a part of the thermoplastic resin to adhere the first sheet. The molding apparatus molds a molded object by repeating the steps of cutting a sheet by the cutting part 160, removing an unnecessary region from the sheet by the removing part 165, stacking a sheet by the stacking part 140, and adhering the sheet by the heating part 170.SELECTED DRAWING: Figure 1
申请公布号 JP2016182727(A) 申请公布日期 2016.10.20
申请号 JP20150063928 申请日期 2015.03.26
申请人 SEIKO EPSON CORP 发明人 TAKANO HIDEHIRO
分类号 B29C67/00;B33Y10/00;B33Y30/00 主分类号 B29C67/00
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