| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing method and a plasma processing device, capable of improving bonding substrate productivity by suppressing corrosion of an adhesive layer in a step of removing a resist on a substrate bonded by an adhesive.SOLUTION: There is provided a plasma processing method comprising the steps of: carrying a bonding substrate in which a substrate for device creation and a support substrate are bonded by an adhesive layer into a processing container; forming a protective layer in a peripheral edge of the adhesive by a plasma product generated in a plasma generation region; forming a resist layer on the substrate; processing the substrate using the resist layer as a mask; and removing the resist mask. |
