| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-wire electric discharge machine capable of slicing an ingot in a wafer in a narrow groove width.SOLUTION: A first tool 81a and a second tool 81b of wire molding means 81 are removed by shaving an area of a covering part of a wire R opposed in processing to both side surfaces of a processing groove of an ingot formed by electric discharge machining before the wire R electrical-discharge-machines the ingot. Thus, a line width of the wire R can be narrowed in the groove width direction of the processing groove. Since a core part is exposed in an area of a peripheral surface of the wire R opposed to both side surfaces of the processing groove, discharge can be made hard to be generated to both side surfaces of the processing groove. Thus, electric discharge machining to both side surfaces of the processing groove of the ingot can be restrained.SELECTED DRAWING: Figure 3 |
