Electronic component embedded substrate and method for manufacturing electronic component embedded substrate

摘要

The present invention can reduce warpage while minimizing unnecessary wiring of an electronic component embedded substrate by including an electronic component; a first wiring layer; and a second wiring layer, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer and a first insulating portion is made of a material having a lower coefficient of thermal expansion than a second insulating portion.

主权项

1. An electronic component embedded substrate comprising:
an electronic component comprising a first surface having first external terminals thereon and a second surface opposite the first surface and made of an insulating material; a first wiring layer provided on the first surface and comprising a first wiring portion electrically connected to the first external terminal and a first insulating portion; and a second wiring layer provided on the second surface and comprising a second wiring portion and a second insulating portion, wherein at least one of the number of layers and wiring density of the first wiring layer is greater than at least one of the number of layers and wiring density of the second wiring layer, respectively, and the first insulating portion is made of a material having a lower coefficient of thermal expansion than the second insulating portion.