| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless gold plating and aldehyde-amine adduct replenishment liquid, which is stably used without lowering plating speed associated with accumulation of sub-reaction product, even if heating standby time of electroless gold plating liquid becomes long.SOLUTION: Solution is obtained by the electroless gold plating comprising (a) gold cyanide and (b) complex agent, and (c) the aldehyde compound and (d) the electroless gold plating liquid comprising the amine compound expressed by the following general formula (1), and (c') the aldehyde-amine compound and (d') the aldehyde-amine adduct replenish liquid comprising the amine compound expressed by the following general formula. R-NH-R(1)[In the general formula (1), Rand Rare electron donating groups, and 2≤m≤12, n=1, where the number of carbon atoms (C) in a molecule is m, and the number of second class amino groups (-NH-) in a molecule is n.SELECTED DRAWING: None |
