Integrated fan-out structure and method

摘要

A semiconductor package comprises a top package and a bottom package with fan-out interconnect structures. A plurality of inter-package connectors electrically connect the top package and the bottom package, and are located near a perimeter of the semiconductor package. A first material is located in a space delimited by a lower surface of the top package, an upper surface of the bottom package, and the inner-most inter-package connectors of the semiconductor package, wherein the first material partially fills the space. A second material different from the first material encapsulates the inter-package connectors.

主权项

1. A semiconductor package, comprising:
a top package; a bottom package with fan-out interconnect structures; a plurality of inter-package connectors electrically connecting the top package and the bottom package and located near a perimeter of the semiconductor package; a first material located in a space delimited by a lower surface of the top package, an upper surface of the bottom package, and the inner-most inter-package connectors of the semiconductor package, wherein the first material partially fills the space; and a second material different from the first material encapsulating the inter-package connectors; wherein the first material is a mixture of a solute and a solvent, wherein the solute is a material selected from the group consisting of SiO2, Al2O3 and TiO2, and the solvent is a material selected from the group consisting of epoxy, acrylic, polypropylene, polyimide, and combinations thereof.