| 摘要 |
A semiconductor device has such a construction that free tip ends (15a, 16a) of stage bars (15,16) extending from a stage (12) do not extend to side surfaces (17a, 17b) of a resin package (17), and the resin package (17) is constituted by an inner resin package portion (18) and an outer resin package portion (19). The free tip ends of the stage bars (15,16) are located inside the outer resin package portion (19) and are completely sealed. A method of producing the semiconductor device comprises the steps of providing wires for electrically connecting terminals of a semiconductor element (11) which is mounted on the stage (12) with corresponding leads, forming the inner resin package portion (18) over the semiconductor element (11) and its vicinity including portions of the leads and stage bars (15,16) which are connected to the stage, cutting free tip ends of the stage bars (15,16), and forming the outer resin package portions (19) over the inner resin package portion and the remaining portion of the semiconductor device so that the cut free tip ends of the stage bars are completely sealed inside the outer resin package portion. |
