| 摘要 |
An electrostatic wafer-holding chuck includes first and second dielectric plates formed of single crystal aluminum oxide and at least one electrode disposed within a recess formed in the first dielectric plate. The second dielectric plate has a top wafer-supporting surface that has a fluid distribution network formed therein. The fluid distribution network channels a heat transfer medium to the backside of the wafer. When the first and second dielectric plates are assembled, the first dielectric plate is disposed contiguous to the second dielectric plate and then are diffusively joined together to form a monolithic, hermetically-sealed electrostatic chuck.
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