发明名称 Polyamide resin composition
摘要 A polyamide resin composition comprising 100 parts by weight of a polyamide resin and 0.005 to 1.0 part by weight of at least one compound selected from the group consisting of a metal salt of a fatty acid, a diamide compound and a diester compound. The polyamide resin is obtained by solid phase-polymerizing a polyamide resin prepared by melt-polymerizing a diamine component containing 70 mol % or more of metaxylylenediamine and a dicarboxylic acid component containing 70 mol % or more of adipic acid, and preferably has a relative viscosity of 2.3 to 4.2 when measured at 25 DEG C. using a solution of 1 g polyamide resin in 100 ml of 96% sulfuric acid. By adding at least one compound selected from the group consisting of the specific metal salt of fatty acid, the diamide compound and the diester compound to a solid phase-polymerized polyamide resin, shaped articles such as films, sheets and hollow containers made of the solid phase-polymerized polyamide are improved in the resistance to whitening during storage tinder a high humid condition, upon contacting with water or boiling water, or upon heating to a glass transition temperature or higher.
申请公布号 US6166171(A) 申请公布日期 2000.12.26
申请号 US19990259611 申请日期 1999.03.01
申请人 MITSUBISHI GAS CHEMICAL COMPANY, INC. 发明人 YAMAMOTO, KOJI;TAKAHASHI, MAKOTO;SHIMAZAKI, HISASHI;MARUYAMA, KATSUYA
分类号 C08G69/30;C08G69/48;C08K5/098;C08K5/20;(IPC1-7):C08G73/10;B32B27/00;C08L77/00 主分类号 C08G69/30
代理机构 代理人
主权项
地址
您可能感兴趣的专利