发明名称 |
PRINTED CIRCUIT BOARDS |
摘要 |
The present invention relates to the making of high density printed circuit boards with, inter alia, microvias. The method includes the steps of forming an inner core (40) having a circuit pattern (44) on at least one side thereof, applying resin (48) in liquid form to at least one side of core and pressing a prepreg (50) or resin coated conductor to the core (40).
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申请公布号 |
WO0184896(A1) |
申请公布日期 |
2001.11.08 |
申请号 |
WO2001GB01948 |
申请日期 |
2001.05.03 |
申请人 |
TIMMS, KEVIN, FREDERICK, KUANG;ONGKOSIT, BANCHA |
发明人 |
ONGKOSIT, BANCHA |
分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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