| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive tape which is used for processing a wafer and can minimize the sizes of broken portions and cracks and control their occurrences, when the wafer is cut into chips, to provide a method for producing the adhesive tape which is friendly for environments, and to provide a method for using the adhesive tape, by which the performance of the adhesive tape for processing the wafer can maximally be exhibited. SOLUTION: This adhesive tape which has an adhesive layer on one side of a substrate layer and is used for processing the wafer is characterized in that the maximum length of the broken portions or the cracks is <=30μm, when a silicon wafer adhered to the adhesive layer of the tape is fully cut with a dicer into chips at a dicing speed of 70 mm/min. The adhesive tape which has an adhesive layer on one side of a substrate layer and is used for processing the wafer, characterized in that the storage elastic modulus G' of the adhesive layer at 15 to 35 deg.C is >=1 MPa. It is preferable that the tanδof the adhesive layer at 15 to 35 deg.C is >=0.05. |
