| 摘要 |
An advanced microelectronic coil device (300) incorporating a toroidal core (302) and a plurality of sets of windings (312, 318) wherein the windings are separated by one or more layers (333) of insulating material. In one embodiment, the insulating material is vacuum-deposited over the top of a first set of windings (312) before the next set of windings (318) is wound onto the core(302). In this fashion, the layer(s) (333) of insulating material insulates the entire first winding (312) from the second (318) without the need for individual insulation on each of the windings, or the use of margin tape. The use of the vacuum-deposited insulating layer(s) (333) of the invention provides a high degree of dielectric strength, yet consumes a miniumum space since the insulation on each winding is minimized. The toroidal core (302) is also optionally provided with a controlled thickness gap (310) for controlling saturation of the core. A method of manufacturing the aforementioned device using a vacuum deposition process is disclosed, wherein the thickness and coverage of the insulating layer(s) (333) may be controlled. An improved component package, microelectronic connector, and circuit board assembly incorporating the improved toroid device are also disclosed. |
