PLASMA TREATMENT APPARATUS, ELECTRODE PLATE FOR PLASMA TREATMENT APPARATUS AND ELECTRODE PLATE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To efficiently uniformalize plasma density in a plasma treatment apparatus.

SOLUTION: A projecting part 70 is protruded toward an upper electrode side, namely, toward a plasma side on the principal surface of a susceptor 12 electrically coupled with plasma with lower impedance than the bottom face 12a of the principal surface. Therefore, high-frequency power which is carried by a high frequency current flowing on a top face layer of the principal surface of the susceptor 12 is mainly discharged from the top face of the projecting part 70 to the plasma. In order to increase a ratio Z12a/Z70between the impedance Z70of the projecting part 70 and the impedance Z12aof the bottom face 12a on the principal surface of the susceptor 12, a dielectric 72 is provided around the projecting part 70 (on the bottom face 12a).

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