| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problems that positioning with high precision is required in mounting when an IC chip is connected to a dipole antenna board, and also a mounting cost is increased so as to raise a tag price since the antenna board is formed by etching, etc. <P>SOLUTION: Positioning is facilitated by using the IC chip by which the two input/output terminals of the IC chip are respectively taken out from a surface and a back surface. Two upper and lower rectangular antennas are used for superimposition only on a semiconductor element, and the area is made to be equal to or not more than the area of the semiconductor element. Consequently, a thin dipole non-contact IC tag is obtained by which a communication characteristic is not deteriorated and a cost is reduced, and which is excellent in the communication characteristic with high reliability. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
