| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize a solder bonding of high reliability by ensuring a solder layer of necessary thickness between a lead frame and a copper circuit pattern when the lead frame is soldered and bonded onto the copper circuit pattern of an insulating substrate. <P>SOLUTION: In a semiconductor device wherein the lead frame 4 for internal wiring is soldered and bonded on the copper wiring pattern 2 of the insulating substrate 1 on which a semiconductor chip is to be mounted, a solder dam 6 is formed which surrounds a solder bonding surface region to the lead frame and prevents flowing-out of fused solder to a surface of the copper circuit pattern. In the solder dam, height Hd from the surface of the copper circuit pattern is set as height which is at least necessary thickness t of a solder bonding layer. The solder dam is formed of a thermosetting resin or a light-hardened resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
