| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist composition suitable for use under an exposure light source of ≤200 nm, particularly F<SB>2</SB>excimer laser light (157 nm), and to specifically provide a positive resist composition which exhibits satisfactory transmittance when a light source of 157 nm is used and is excellent in various properties such as affinity for a developer and image forming property. <P>SOLUTION: The positive resist composition contains (A) a resin having a fluorine-containing specified repeating unit and having solubility in an alkali developer increased by the action of an acid and (B) a compound which generates an acid upon irradiation with an actinic ray or radiation. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
