| 摘要 |
A low profile ball grid array having an exposed die and a method for manufacturing the same are provided to reduce the length of a wire bond required for connecting an IC die to a substrate by arranging the IC die in a through-cavity opening. A substrate(102) has first and second surfaces opposite to each other. A plurality of contact pads on the first surface of the substrate are electrically connected to a plurality of bond pads on the second surface of the substrate. The substrate has a through-cavity opening(248). An IC die has first and second surfaces opposite to each other. A wire bond connects a bond pad on the first surface of the IC die to a bond pad on the second surface of the IC die. An encapsulation material encapsulates the IC die and the wire bond so as to expose the second surface of the IC die, thereby allowing the IC die to be supported in the through-cavity opening. The plurality of contact pads are plural solder ball pads. |
