| 摘要 |
An electronic component comprises a first material, a second, layer formed material, and a layered third material. Viewed perpendicular to the substrate surface, the second material follows the first and the third follows the second. The adhesion force of the second material on the first is smaller than that of the third material on the first. The second material has an opening via which the third material is connected to the first to increase the adhesion of the second material to the first. |
