METHOD FOR FORMATION OF SEMICONDUCTOR PACKAGE USING PHOTO SENSITIVE ADHESIVE

摘要

A method for fabricating a semiconductor package using a photo sensitive adhesive is provided to prevent the contamination of a bonding pad due to an adhesive by removing the adhesive from the bonding pad. A photo sensitive adhesive(114) is formed on an upper surface of a semiconductor chip(110) including a bonding pad(112). A PCB substrate is bonded over the photo sensitive adhesive. The bonding pad is overlapped with a slot that is formed on the PCB substrate. Ultraviolet rays are irradiated to the photo sensitive adhesive exposed by the slot. The photo sensitive adhesive to which the ultraviolet rays are irradiated is removed to expose the bonding pad. The exposed bonding pad and the PCB substrate are wire-bonded by a bonding wire. A sealing member is formed to surround the bonding wire. The sealing member also surrounds the other surface of the semiconductor chip. A connecting electrode is formed on a connection pad that is exposed on the PCB substrate.