发明名称 POSITION SENSOR PRODUCTION METHOD, AND POSITION SENSOR PRODUCED BY THE METHOD
摘要 In a position sensor production method, a photosensitive resin layer of a core formation photosensitive resin is light-exposed to form cores in a lattice pattern portion and in a peripheral pattern portion bent along an outer periphery of the lattice pattern portion and form non-light-path dummy cores in the peripheral pattern portion. Surfaces of the exposed portion of the photosensitive resin layer of the core formation photosensitive resin serving as the cores and the non-light-path dummy cores and an exposed portion are covered with a photosensitive resin layer of a second cladding formation photosensitive resin and, in this state, the core formation photosensitive resin of the unexposed portion and the second cladding formation photosensitive resin of the photosensitive resin layer are mixed together by heating to form a mixture layer. The mixture layer is light-exposed to be cured to form an over-cladding layer.
申请公布号 US2016238416(A1) 申请公布日期 2016.08.18
申请号 US201415024562 申请日期 2014.07.22
申请人 NITTO DENKO CORPORATION 发明人 Shimizu Yusuke;Yoshioka Ryoma
分类号 G01D5/353;G03F7/20;G06F3/042 主分类号 G01D5/353
代理机构 代理人
主权项 1. A position sensor production method comprising: fabricating a sheet-form optical waveguide including a plurality of linear light-path cores; and connecting an optical element to end faces of the light-path cores; wherein the optical waveguide fabricating step comprises: forming a first cladding layer; forming a first photosensitive resin layer of a core formation photosensitive resin on a surface of the first cladding layer; light-exposing the first photosensitive resin layer of the core formation photosensitive resin in a predetermined pattern including a lattice pattern portion and a peripheral pattern portion extending from the lattice pattern portion to be bent along an outer periphery of the lattice pattern portion, to form light-path cores in the lattice pattern portion and to form light-path cores and non-light-path dummy cores in the peripheral pattern portion, the light-path cores and the non-light-path dummy cores being defined by portions of the first photosensitive resin layer of the core formation photosensitive resin cured by the light exposure; after the light-exposing step, covering surfaces of the exposed portions of the first photosensitive resin layer of the core formation photosensitive resin serving as the cores and the dummy cores and an unexposed portion of the first photosensitive resin layer of the core formation photosensitive resin with a second photosensitive resin layer of a second cladding formation photosensitive resin; heating the first and second photosensitive resin layers, whereby the core formation photosensitive resin of the unexposed portion of the first photosensitive resin layer and the second cladding formation photosensitive resin of the second photosensitive resin layer are mixed together to form a mixture layer; and light-exposing the mixture layer to cure the mixture layer to form a second cladding layer; wherein the end faces of the light-path cores to be connected to the optical element are end faces of the light-path cores formed in the peripheral pattern portion.
地址 Ibaraki-shi, Osaka JP