| 摘要 |
PROBLEM TO BE SOLVED: To manufacture an electronic component that preferably shields an electromagnetic wave and has an excellent heat dissipation in a high productivity.SOLUTION: A mounted substrate 13 in which an electronic element 3 and a projection conductive member 6 are mounted to a main surface 9 is disposed to an upper mold 15. A plate-like member 5 in which a cream solder 20 is previously coated to a position where the conductive member 6 contacts is disposed to an inner bottom surface of a cavity 17 of a lower mold 16. A liquid resin 21 is injected to the cavity 17, the upper mold 15 and the lower mold 16 are clamped, conductive member 6, a metal thin wire 11, the electronic element 3, a bonding pad 7, and the main surface 9 of the mounted substrate 13 are dipped in the liquid resin 21, and the conductive member 6 contacts with the plate-like member 5 through the cream solder 20. A sealing resin 4 is formed by hardening the liquid resin 21, and a sealed substrate 22 is completed. In a state where the conductive member 6 is pressed by the plate-like member 5 depending on a compression stress at hardening the liquid resin 21, the conductive member 6 and the plate-like member 5 are surly electrically connected by the cream solder 20.SELECTED DRAWING: Figure 3 |
