发明名称 Structure and method to reduce shorting in STT-MRAM device
摘要 A method of making a magnetic random access memory (MRAM) device includes depositing a spacer material on an electrode; forming a magnetic tunnel junction (MTJ) on the spacer material that includes a reference layer in contact with the spacer material, a free layer, and a tunnel barrier layer; patterning a hard mask on the free layer; etching the MTJ and the spacer material to transfer a pattern of the hard mask into the MTJ and the spacer material; forming an insulating layer along a sidewall of the hard mask, the MTJ, and the spacer material; disposing an interlayer dielectric (ILD) on and around the hard mask, MTJ, and spacer material; etching through the ILD to form a trench that extends to a surface and sidewall of the hard mask and a sidewall of a portion of the MTJ; and disposing a metal in the trench to form a contact electrode.
申请公布号 US9450180(B1) 申请公布日期 2016.09.20
申请号 US201514968287 申请日期 2015.12.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 Annunziata Anthony J.;Lauer Gen P.;Marchack Nathan P.
分类号 H01L43/12;H01L43/02;H01L43/08;H01L43/10 主分类号 H01L43/12
代理机构 Cantor Colburn LLP 代理人 Cantor Colburn LLP ;Alexanian Vazken
主权项 1. A method of making a magnetic random access memory (MRAM) device, the method comprising: depositing a spacer material on an electrode; forming a magnetic tunnel junction (MTJ) on the spacer material, the MTJ comprising a reference layer positioned in contact with the spacer material, a free layer, and a tunnel barrier layer arranged between the reference layer and the free layer; patterning a hard mask on the free layer of the MTJ; etching the MTJ and the spacer material to transfer a pattern of the hard mask into the MTJ and the spacer material; forming an insulating layer along a sidewall of the hard mask, the MTJ, and the spacer material; disposing an interlayer dielectric (ILD) on and around the hard mask, the MTJ, and the spacer material; etching through the ILD to form a trench that extends to a surface and a sidewall of the hard mask and a sidewall of a portion of the MTJ; and disposing a metal in the trench to form a contact electrode.
地址 Armonk NY US