Package-on-package assembly and method for manufacturing the same

摘要

A package-on-package (PoP) assembly includes a bottom die package and a top die package mounted on the bottom die package. The bottom die package includes an interposer having a first side and a second side opposite to the first side, at least one chip mounted on the first side within a chip mounting area through a plurality of bumps, a molding compound disposed on the first side, the molding compound covering the at least one chip, and a plurality of peripheral bump structures penetrating through the molding compound within the peripheral area. Each of the peripheral bump structures includes conductive pillar and a partial TMV directly stacked on the conductive pillar. A plurality of solder balls is mounted on the second side of the interposer. The top die package is electrically connected to the peripheral bump structures.

主权项

1. A package-on-package (PoP) assembly, comprising:
a bottom die package comprising:
an interposer having a first side and a second side opposite to the first side;at least one chip mounted on the first side within a chip mounting area through a plurality of bumps;a molding compound disposed on the first side, the molding compound being adjacent to the at least one chip;a plurality of peripheral bump structures penetrating through the molding compound within the peripheral area, wherein each of the peripheral bump structures comprises a conductive pillar embedded in the molding compound and a partial through-mold-via (partial TMV) directly stacked on the conductive pillar, wherein the conductive pillar comprises a first conductive stud and a second conductive stud stacked on the first conductive stud; anda plurality of solder balls mounted on the second side; a top die package mounted on the bottom die package and connected to the peripheral bump structures.