| 主权项 |
1. A thin film forming apparatus, comprising:
a substrate holding portion that holds a substrate; and a target portion facing a substrate held by the substrate holding portion, wherein the target portion includes a plurality of targets arranged at predetermined intervals and parallel to the substrate held by the substrate holding portion, the substrate holding portion moves the substrate held by the substrate holding portion parallel to the target portion, the thin film forming apparatus further includes a shield portion that blocks sputtered particles flying from the target portion, the shield portion is placed on the target portion side of the substrate held by the substrate holding portion, so as to face a gap between adjoining ones of the targets, the thin film forming apparatus further includes a partition wall portion provided between the adjoining ones of the targets, the partition wall portion blocks the sputtered particles flying from the targets, the partition wall portion includes flange portions that extend from the partition wall portion and face a portion of the gap between the adjoining ones of the targets, and the flange portions are provided above the targets such that lower surfaces of each of the flange portions are above uppermost surfaces of the targets, and the lower surfaces of each of the flange portions overlap ends of the gap between the adjoining ones of the targets. |
