Parallel scan distributors and collectors and process of testing integrated circuits

摘要

An integrated circuit (70) having parallel scan paths (824-842, 924-942) includes a pair or pairs of scan distributor (800,900) and scan collector (844,944) circuits. The scan paths apply stimulus test data to functional circuits (702) on the integrated circuit and receive response test data from the functional circuits. A scan distributor circuit (800) receives serial test data from a peripheral bond pad (802) and distributes it to each parallel scan path. A scan collector circuit (844) collects test data from the parallel scan paths and applies it to a peripheral bond pad (866). This enables more parallel scan paths of shorter length to connect to the functional circuits. The scan distributor and collector circuits can be respectively connected in series to provide parallel connections to more parallel scan paths. Additionally multiplexer circuits (886,890) can selectively connect pairs of scan distributor and collector circuits together. The scan distributor and collector circuits can be formed in core circuits (704). The core circuits then can be connected to other core circuits and functional circuits with simple connections to the parallel scan circuits through the scan distributor and collector circuits.

主权项

1. An integrated circuit comprising:
A. functional circuits that include a first bond pad and a second bond pad, the functional circuits including first level circuitry, second level circuitry, and third level circuitry; B. first test circuitry including:
i. first parallel scan path circuits, each of the first parallel scan path circuits having stimulus outputs connected to the first level circuitry, response inputs connected to the first level circuitry, a serial input and a serial output;ii. first distributor circuits having a serial input connected to the first bond pad, a serial output, and parallel outputs, each parallel output being connected to an input of a first parallel scan path circuit; andiii. first collector circuits having a serial output connected to the second bond pad, a serial input, and parallel inputs, each parallel input being connected to an output of a first parallel scan path circuit; C. second test circuitry including:
i. second parallel scan path circuits, each of the second parallel scan path circuits having stimulus outputs connected to the second level circuitry, response inputs connected to the second level circuitry, a serial input and a serial output;ii. second distributor circuits having a serial input connected to the output of the first distributor circuits, a serial output, and parallel outputs, each parallel output being connected to an input of a second parallel scan path circuit; andiii. second collector circuits having a serial output connected to the serial input of the first collector circuits, a serial input, and parallel inputs, each parallel input being connected to an output of a second parallel scan path circuit; and D. third test circuitry including:
i. third parallel scan path circuits, each of the third parallel scan path circuits having stimulus outputs connected to the third level circuitry, response inputs connected to the third level circuitry, a serial input and a serial output;ii. third distributor circuits having a serial input connected to the output of the second distributor circuits, a serial output, and parallel outputs, each parallel output being connected to an input of a third parallel scan path circuit; andiii. third collector circuits having a serial output connected to the serial input of the second collector circuits, a serial input, and parallel inputs, each parallel input being connected to an output of a third parallel scan path circuit.