发明名称 POLYIMIDE RESIN-CONTAINING AQUEOUS DISPERSION COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a polyimide resin-containing aqueous dispersion composition that is excellent in heat resistance, adhesion, and coating film mechanical properties and also excellent in and solution storage stability.SOLUTION: An aqueous dispersion composition comprises a polyimide resin (A) comprising an alkylene glycol bisanhydrotrimellitate residue and a diisocyanate residue and having an acid number of 15-100 mgKOH/g, and an amine (B) with 1-10 equivalent weight relative to the acid value of the polyimide resin (A).SELECTED DRAWING: None
申请公布号 JP2016199749(A) 申请公布日期 2016.12.01
申请号 JP20160077989 申请日期 2016.04.08
申请人 TOYOBO CO LTD 发明人 HAMANO SHIGEYOSHI;HATSUTORI TAKAHIRO;SHINO KATSUYA
分类号 C08L79/08;C08G73/16;C08K5/17;C08K5/29;C08K5/3477;C08L63/00;C09J11/06;C09J175/04;C09J179/08 主分类号 C08L79/08
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