发明名称 ROOM TEMPERATURE-CURING COMPOSITION
摘要 PURPOSE:To obtain a room temperature-curing composition useful as a sealing material which can give a cured product without leaving surface stickiness by mixing a hydrolyzable silicon group-terminated polyalkylene ether with a polyoxyalkylene monoether, a filler and a curing catalyst. CONSTITUTION:A room temperature-curing composition is obtained by mixing 100 pts.wt. polyalkylene ether (desirably polypropylene ether) of an MW of about 1000-30000, desirably 5000-15000, terminated with a hydrolyzable silicon functional group with 10-100 pts.wt., desirably 30-70 pts.wt. polyoxyalkylene monoether (desirably polyoxypropylene mono-(1-7C)-alkyl ether or polyoxypropylene monophenyl ether) 5-300 pts.wt., desirably 50-200 pts.wt. filler and 0.1-10 pts.wt., desirably 0.5-5 pts.wt. silanol condensation catalyst.
申请公布号 JPH02142850(A) 申请公布日期 1990.05.31
申请号 JP19880297270 申请日期 1988.11.24
申请人 KONISHI KK 发明人 MATSUI TORU;UMEYA ITARU;YONEMUSHI MASAKAZU
分类号 C08J3/24;C08K3/00;C08L71/00;C08L71/02 主分类号 C08J3/24
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