Surface acoustic wave device manufacturing method, surface acoustic wave device, and communications equipment

摘要

After electrode patterning on an electrode forming surface of a piezoelectric substrate 2 (FIG. 1 (b)), a conductor layer is formed on an electrode non-forming surface of the piezoelectric substrate 2 (FIG. 1 (c)). After forming the conductor layer, the conductor layer formed on the other surface is removed (FIG. 1 (f)) after at least one step (FIG. 1 (e)), and thereafter, dicing for separation into elements and mounting on a mounting substrate are carried out. By removing all the conductor layer on the other surface of the piezoelectric substrate, the out-of-passband attenuation and isolation performance can be significantly improved.