发明名称 RESIN MOLDED FORM WITH ELEMENT TO BE SEALED AND MANUFACTURE THEREOF
摘要 PURPOSE:To use an element to be sealed which needs electric insulation and rustproofness in a high humidity atmosphere or in an easily water-submerged state by so providing a thermoplastic resin containing a fibrous matter as to cover the entire element to be sealed by a compression molding method using molds. CONSTITUTION:A laminate 3 is introduced into a heating furnace, and heated to become 220 deg.C for 8min. In this case, since the laminate 3 is expanded by heating, an interval (h) between a heater 9 for heating and the laminate 3 is maintained at a predetermined interval. When heating of the laminate 3 is completed, the laminate 3 is immediately introduced into spigotlike molds for molding a resin molded form having 400X400X7mm of an inner size, and pressed under a pressure of 10kg/cm<2> at a mold temperature of 100 deg.C for one min to obtain a resin molded form in which an element to be sealed 2 is entirely covered with a sealer 1 made of polypropylene resin 1a containing a glass fiber 1b.
申请公布号 JPH0760836(A) 申请公布日期 1995.03.07
申请号 JP19930207876 申请日期 1993.08.23
申请人 SEKISUI PLASTICS CO LTD 发明人 ISHIBASHI MASATOSHI;IKENAGA MASAHIRO;YAMAGUCHI TETSUO
分类号 B29C43/18;B29C63/02;B29K105/06;B29L31/34;(IPC1-7):B29C63/02 主分类号 B29C43/18
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