MOLD FOR SEALING SEMICONDUCTOR WITH RESIN,申请号JP19970184758-传众专利搜索

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发明名称	MOLD FOR SEALING SEMICONDUCTOR WITH RESIN
摘要
申请公布号	JPH1128742(A)	申请公布日期	1999.02.02
申请号	JP19970184758	申请日期	1997.07.10
申请人	NEC CORP	发明人	NISHIKAWA KENJI
分类号	B29C45/26;B29C45/02;H01L21/56;(IPC1-7):B29C45/26	主分类号	B29C45/26
代理机构		代理人
主权项
地址

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