发明名称 POLYIMIDE FILM IMPROVED IN ADHESION, PRODUCTION THEREOF AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a polyimide film improved in adhesion while holding the thermal characteristics and electric/electronic characteristics of the polyimide film, a method for producing the same and a laminate. SOLUTION: A soln. containing polyamic acid obtained from 2,3,3',4'- biphenyltetracarboxylic acid dianhydride and 4,4'-diaminodiphenyl ether is applied to or sprayed on a self-supporting film formed by a casting method of a dope obtained from 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and p-phenylenediamine and containing an imidating catalyst according to circumstances and the coated film is heat-treated to obtain a polyimide film improved in adhesion.
申请公布号 JP2000043211(A) 申请公布日期 2000.02.15
申请号 JP19980216893 申请日期 1998.07.31
申请人 UBE IND LTD 发明人 YAMAMOTO TOMOHIKO;UEKIDO TAKESHI;NISHINO TOSHIYUKI
分类号 B32B15/088;B32B15/08;B32B27/34;C08G73/10;(IPC1-7):B32B27/34 主分类号 B32B15/088
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