发明名称 |
DEVICE FOR DETECTING COMPLETION OF PROCESSING |
摘要 |
PROBLEM TO BE SOLVED: To detect the completion of a reaction in a plasma apparatus which is used for processing of semiconductor wafer. SOLUTION: A light is emitted from a light-projecting part 22 to a semiconductor wafer 6 and a reflected light thereon is received by a light-receiving part 23. An output of received light is inputted into a signal processing circuit 26. An input signal is differentiated by the signal processing circuit 26. After the start of processing, a width change in derivative value becomes larger gradually, and based on its unchanging after the completion of processing completion of etching or ashing of the surface of a semiconductor can be detected.
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申请公布号 |
JP2000183041(A) |
申请公布日期 |
2000.06.30 |
申请号 |
JP19980357399 |
申请日期 |
1998.12.16 |
申请人 |
OMRON CORP |
发明人 |
KUROKAWA MASAHIRO;KIYOMOTO HIRONOBU |
分类号 |
H01L21/302;C23F4/00;H01L21/3065;(IPC1-7):H01L21/306 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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