发明名称 NEAR HERMETIC POWER CHIP ON BOARD DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 Near-hermetic performance has been reported for power semiconductor devices having a silicon carbide layer deposited on the surface at the semiconductor wafer level. The P-COB device also includes a conformal coating on the silicon carbide layer, which extends the expected lifetime of the P-COB device longer than those devices without protective coatings.
申请公布号 US2005040530(A1) 申请公布日期 2005.02.24
申请号 US20030630777 申请日期 2003.07.31
申请人 SHI FONG 发明人 SHI FONG
分类号 H01L23/00;H01L23/057;H01L23/08;H01L23/31;(IPC1-7):H01L23/48 主分类号 H01L23/00
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