SEMICONDUCTOR ELEMENT MOUNTING MEMBER AND SEMICONDUCTOR DEVICE USING SAME

摘要

A semiconductor element mounting member wherein a substrate and a frame are bonded in parallel with excellent productivity and further with excellent accuracy is provided. A semiconductor device wherein a semiconductor element, such as an image pickup element, is sealed in a status where a cover is highly accurately aligned with the semiconductor element by using the semiconductor element mounting member is also provided. In the semiconductor element mounting member (BL), the substrate (1) and the frame (2) are bonded with a bonding layer (3) made of an adhesive resin, and in the bonding layer (3), a region between one plane (10) of the substrate (1) and a lead terminal (4) is permitted to have an elasticity of 400MPa or more at 150°C. In the semiconductor device, the semiconductor element is mounted on an element mounting section (10a) of the semiconductor element mounting member (BL), and the cover is bonded on the frame (2).