发明名称 SURFACE TREATMENT METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a surface treatment method, by which a treatment for modifying a surface of a substrate to be treated can be conducted without any plasma damage and which has a large flexibility of the installation site of the substrate to be treated, and an apparatus therefor. SOLUTION: The surface of the substrate is treated by producing a treatment gas containing a nitrogen oxide chosen from N<SB>2</SB>O, NO and NO<SB>2</SB>in a surface treatment unit 30 and contacting the treatment gas with a metal oxide formed on the surface of the substrate 10 via an air supply connecting tube 20 and an air supply part 22 to reduce or replace the metal oxide on the substrate 10 by the nitrogen oxide. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2006342432(A) 申请公布日期 2006.12.21
申请号 JP20060224232 申请日期 2006.08.21
申请人 SEIKO EPSON CORP 发明人 MIYAGAWA TAKUYA;TSUTSUI TAKUJI;MORI YOSHIAKI;KATO MASAKI;KURASHIMA YOHEI
分类号 C23G5/00;B08B5/00;B23K1/20;H01L21/304;H01L21/60 主分类号 C23G5/00
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