| 摘要 |
A chip scale package is provided to obtain a thermal expansion coefficient of a substrate similar to a thermal expansion coefficient of a semiconductor chip by applying a polyimide flex laminate to a circuit forming part of an external layer of a substrate structure. A plurality of circuit patterns are formed on an upper surface and a lower surface of a substrate(10). A semiconductor chip(30) is attached on the upper surface of the substrate. A wire(40) is used for connecting electrically the substrate and the semiconductor chip. A sealing agent(50) is used for sealing the upper surface of the substrate including the semiconductor chip and the wire. A plurality of solder balls(60) are positioned on the lower surface of the substrate to be electrically connected with an external circuit. An insulating film(10a) is formed on the substrate. A plurality of polyimide layers(10b) are formed on the upper surface and the lower surface of the insulating film. A circuit pattern(10c) is formed on each of the polyimide layers. A solder resist(10d) is formed to expose the circuit pattern by covering the insulating film and the polyimide layers.
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