SEMICONDUCTOR PACKAGE HAVING ANCHOR TYPE JOINING AND METHOD OF FABRICATING THE SAME

摘要

A semiconductor package having an anchor type coupling structure and a manufacturing method thereof are provided to improve connection reliability by contacting directly a plug structure to an oxidation-preventing metal pattern of a different package unit in a socket region. A plurality of semiconductor chips are manufactured. A plug structure(199) is formed, and the plug structure penetrates the semiconductor chip and defines a recessed socket region from the one surface of the semiconductor chip, and then is protruded to the other surface. The plug structure is connected directly to the inner sidewall of the socket region by inserting the plug structure into the socket region of the other semiconductor chip.