| 摘要 |
A display driving chip is provided to prevent the damage of a driving chip by distributing the compression against input/output pads when bonding the driving chip. A lower line is formed on an active area(11). Input and out pads(12) are electrically connected with the lower lines of the active area and formed at the inside edge of the active area. Dummy pads(13) are formed at the inside of the input and output pads. The input and output pads includes the first metal pad connected with the lower lines. At least one or more via holes are formed on the first metal pad. The second metal pad is formed on the upper portion of via. The dummy pads also do not connected with the lower lines electrically. The input and output pads or dummy pads are formed by a double structure of the first and second metal pads. The distance of the input and output dummy pads is 10-500 micrometer. |
