| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board, capable of improving adhesive strength between a conductor circuit and an adhesive agent layer, and to provide its manufacturing method. SOLUTION: A flexible printed circuit board 2 includes a substrate 4 and the conductor circuit 5 formed on the flexible substrate 4. The conductor circuit 5 is electrically connected to another conductor circuit or electronic components through a conductive adhesive agent layer. In this case, a groove 15 is formed at a part in contact with the conductive adhesive agent layer on the surface 5a of the conductor circuit 5. Accordingly, the adhesion property of the groove 15 to the adhesive agent layer is improved whereby the adhesive strength of the conductor circuit 5 to the adhesive agent layer is improved. COPYRIGHT: (C)2008,JPO&INPIT
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