发明名称 ELECTRONIC DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electronic device embedded substrate and a manufacturing method of the electronic device embedded substrate.SOLUTION: An electronic device embedded substrate 100 includes: a core substrate 110 comprising a cavity 115 formed therein; an electronic device 120 embedded in the cavity; a first support pattern part 130 which is formed on one surface of the core substrate and pressurizes the electronic device to restrict a movement of the electronic device within the cavity; and a second support pattern part 140 which is formed on another surface of the core substrate facing the one surface and extended toward an inner side of the cavity so as to support the electronic device.SELECTED DRAWING: Figure 1
申请公布号 JP2016111358(A) 申请公布日期 2016.06.20
申请号 JP20150232266 申请日期 2015.11.27
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 KIM BONG-SOO
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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