| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device.SOLUTION: A semiconductor device comprises a wiring board 10 including a plurality of ball lands 13A and 13B formed on a lower surface of a core layer 11, a solder resist film 15 covering the lower surface of the core layer 11, a via conductor layer 14A penetrating the core layer 11 and connected to the ball lands 13A and 13B, and an upper surface wiring 12 which is formed on the upper surface of the core layer 11 and in which the one end thereof has a bonding land 12A and the other end thereof is connected to the via conductor layer 14A. The semiconductor device further includes a semiconductor chip 1 arranged on the wiring board 10, and a solder ball 20 connected to the ball lands 13A and 13B. The solder resist film 15 includes a deletion part 16 through which the lower surface of the core layer 11 is exposed. The upper-surface wiring 12 includes a thin line part and a thick line part. In a plan view, the thick line part overlaps the deletion part 16.SELECTED DRAWING: Figure 1 |
