发明名称 FLEXIBLE THERMAL CONDUIT FOR AN ELECTRONIC DEVICE
摘要 A flexible thermal conduit runs from a first housing portion of an electronic device to a second housing portion of the electronic device, to convey heat generated by an electronic component located in the first housing portion to a heat dissipation structure located in the second housing portion, where the second housing portion is flexibly coupled to the first housing portion, for example, by a hinge or other type of joint. The flexible conduit may include a plurality of layers of thin, flat thermally conductive material, which may be arranged to flex independently of each other in the region where the first and second housing portions are coupled.
申请公布号 US2016212889(A1) 申请公布日期 2016.07.21
申请号 US201514705893 申请日期 2015.05.06
申请人 Nikkhoo Michael;Heirich Doug;Riccomini Roy;Ye Maosheng;Beerman Michael;Taylor Joseph Daniel 发明人 Nikkhoo Michael;Heirich Doug;Riccomini Roy;Ye Maosheng;Beerman Michael;Taylor Joseph Daniel
分类号 H05K7/20;G02B27/01 主分类号 H05K7/20
代理机构 代理人
主权项 1. An electronic device comprising: a first housing portion containing an electronic component that generates heat during operation; a second housing portion, flexibly coupled to the first housing portion, the second housing portion containing a heat dissipation structure; and a multi-layer flexible thermal conduit that passes from the first housing portion to the second housing portion, to convey heat generated by the electronic component to the heat dissipation structure.
地址 Saratoga CA US