| 发明名称 |
STACK, METHOD FOR TREATING SUBSTRATE MATERIAL, TEMPORARY FIXING COMPOSITION, AND SEMICONDUCTOR DEVICE |
| 摘要 |
There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond. |
| 申请公布号 |
US2016375652(A1) |
申请公布日期 |
2016.12.29 |
| 申请号 |
US201415038738 |
申请日期 |
2014.10.30 |
| 申请人 |
JSR CORPORATION |
发明人 |
YAMAGUCHI TORAHIKO;ISHII HIROYUKI;INOMATA KATSUMI |
| 分类号 |
B32B7/06;B32B37/12;H01L21/683;B32B38/10;C09J165/00;B32B7/12;B32B43/00 |
主分类号 |
B32B7/06 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A stack comprising a substrate material fixed temporarily on a support via a temporary fixing material,
wherein the temporary fixing material comprises
a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, anda temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition comprising a polymer (A) and a release agent (B) which comprises a functional group capable of reacting with the polymer (A) to form a chemical bond. |
| 地址 |
Tokyo JP |
