| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical-mechanical polishing system with a temperature-controlled polishing head increasing a polishing speed to improve polishing uniformity. <P>SOLUTION: A chemical-mechanical polishing system is used for polishing a wafer 6. The chemical-mechanical polishing system has a polishing head, an inner tube 16 connected to the polishing head and filled with a heating medium, a medium heating apparatus 20 connected to the inner tube 16, and a pressure control apparatus 18 connected to the inner tube 16. <P>COPYRIGHT: (C)2008,JPO&INPIT |
