| 发明名称 |
Regeneration of spent electroless copper plating solution |
| 摘要 |
Disclosed is a method for removal of contaminants and replenishment of an electroless copper plating solution in order to allow reuse of the solution. Copper oxide is dissolved in the spent solution and this is followed by an electrodialysis which removes formate and carbonate ions.
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| 申请公布号 |
US5472585(A) |
申请公布日期 |
1995.12.05 |
| 申请号 |
US19940346949 |
申请日期 |
1994.11.30 |
| 申请人 |
AT&T CORP. |
发明人 |
DINELLA, DONALD;LAL, SUDARSHAN;NICOL, DAVID A. |
| 分类号 |
B01D61/44;C23C18/16;(IPC1-7):B01D61/44 |
主分类号 |
B01D61/44 |
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