MANUFACTURE OF ELECTRONIC COMPONENT SOLDERING CIRCUIT BOARD,申请号JP19950151161-传众专利搜索

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发明名称	MANUFACTURE OF ELECTRONIC COMPONENT SOLDERING CIRCUIT BOARD
摘要
申请公布号	JPH08321674(A)	申请公布日期	1996.12.03
申请号	JP19950151161	申请日期	1995.05.26
申请人	TAMURA KAKEN KK	发明人	IWABUCHI MITSURU
分类号	H05K3/34;H05K1/02;H05K1/11;(IPC1-7):H05K3/34	主分类号	H05K3/34
代理机构		代理人
主权项
地址

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