发明名称 Epitaxial growth method
摘要 An epitaxial growth method for forming a high-quality epitaxial growth semiconductor wafer is provided. The method includes forming a single crystalline layer on a single crystalline wafer; forming a mask layer having nano-sized dots on the single crystalline layer; forming a porous buffer layer having nano-sized pores by etching the mask layer and the surface of the single crystalline layer; annealing the porous buffer layer; and forming an epitaxial material layer on the porous buffer layer using an epitaxial growth process.
申请公布号 US7407865(B2) 申请公布日期 2008.08.05
申请号 US20060325462 申请日期 2006.01.05
申请人 SAMSUNG CORNING CO., LTD. 发明人 PARK SUNG-SOO
分类号 H01L21/76;C23C14/06;C23C16/34;H01L21/205 主分类号 H01L21/76
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