| 摘要 |
<p>An epoxy resin composition which is suitable for use in applications such as laminates, metal foil-clad laminates, insulating materials for build-up substrates, flexible printed circuit boards, and materials for flexible printed circuit boards, and gives a cured article excellent in heat resistance, flexibility, adhesion, dielectric properties, and toughness. The epoxy resin composition is characterized by comprising as essential ingredients (a) an epoxy resin, (b) an amine compound hardener, and (c) a block copolymer comprising a polyamide block containing phenolic hydroxyl groups and a poly(butadiene-acrylonitrile) block.</p> |
