MANUFACTURING METHOD FOR MULTILAYER PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method for a multilayer printed-circuit board by which the thickness of a board wiring can be uniformed in manufacturing the multilayer printed-circuit board using an additive method or a semiadditive method. SOLUTION: According to the manufacturing method for the multilayer printed-circuit board using the additive method or semiadditive method, a resist layer is formed on a substrate metal layer formed on the surface of a board, and a wiring pattern is formed on the resist layer. Then a desired metal is made to deposit on the exposed part of the substrate metal layer surface to form a wiring. Afterward, the wiring and the resist layer are ground to form the wiring having a uniform thickness. COPYRIGHT: (C)2005,JPO&NCIPI