CONDENSER MICROPHONE FOR SMD USING SEALING PAD AND METHOD OF MAKING THE SAME

摘要

The present invention relates to a SMD type condenser microphone, and more particularly to a SMD condenser microphone and method for manufacturing the same wherein a sealing pad is employed to improve an acoustic characteristic. The SMD type condenser microphone to be mounted on a main PCB via an SMD process, the SMD type condenser microphone being assembled by inserting components and a PCB in a case comprises the case having an acoustic hole at a bottom surface thereof, the case including at least one groove on a sidewall thereof for exposing the PCB, wherein an extruding portion of the case is curled after the assembly; a ring type sealing pad wherein a portion thereof corresponding to the at least one groove is larger than a rest thereof so as to seal a coupling region when the case is coupled to the PCB; and the PCB having an inner portion inserted inside the case and a protruding portion extruding through the groove of the case.